B Bilgin Global Mod Global Mod 1 Eyl 2023 #1 ‘India must take leadership role in advance packaging of semiconductors’ They said ISRC must focus on advanced packaging of modular chiplet, as it is the future, and participate in global standards bodies to take a leadership role in the industry.
‘India must take leadership role in advance packaging of semiconductors’ They said ISRC must focus on advanced packaging of modular chiplet, as it is the future, and participate in global standards bodies to take a leadership role in the industry.
